Qreer - Junior Product Designer Job in Zurich, Switzerland

Graduates

Companies

Location (s):

  • Switzerland
Zurich

Overview

Our industry leadership in imaging, light and sensors results from a unique combination of wafer-level integration, pragmatic innovation, total supply chain control, a culture of integrity, and a 20+ year track record of delivering breakthrough technologies to leading OEMs. Backed by world-class investors, Heptagon’s teams are located all over the world.

Details

Junior Product Designer (M/F) Job Description

Reporting to: Product Design Team Manager

Responsibilities:

Working a multidisciplinary team being responsible of the mechanical design:

  • Packaging design of optoelectronic devices
  • Getting familiar with Heptagon proprietary opto-electronic packaging technologies
  • Support the other members in the design team with mechanical design, analysis and simulations.
  • Be responsible of the product technical documentation

As a member of the Heptagon team, the candidate will have a wide and varying set of responsibilities as our organization grows and evolves.

These may include:

  • Sharing the responsibility in the mastering/material with other team members.
  • Ongoing support to other members of the team.
  • Contributing to the ongoing creation of a positive, productive work environment
  • Must be willing to travel, 20% of the work time

Opportunity is About:


Eligibility

Candidates should be from:

Description of Ideal Candidate:

Required Skills and Knowledge:

  • Candidates must have at least 1 year of experiences in working microelectronics packaging design.
  • Have a completed education, preferably a master degree in mechanical engineering or electro-mechanical, mechatronic engineering.
  • Must be familiar with 3D CAD tools, (Solid Works, Creo and AutoCAD preferred)
  • Knowledge of an electrical CAD tool (like ORCAD) is also requested.
  • Skill in Computational fluid dynamics (CFD) numerical techniques for thermal modeling and mechanical finite element analysis (FEA) of IC packaging, using FLOSIMULATION or COMSOL is a plus.
  • Have experience designing very small components
  • Knowledge of mechanical and thermal behavior of plastic material
  • Knowledge of various molding techniques
  • Have a very good level in English communication (spoken and written), German is a plus

Dates:

Deadline: August 04, 2019


Cost/funding for participants:

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