
Deadline:
January 15, 2026
Program Starts: June 22, 2026
Program Ends: July 31, 2026
Location(s)
Japan
Overview
The summer program at the University of Tokyo’s School of Engineering, called ESEP, is an opportunity for undergraduate and graduate students to participate in scientific research projects at world-leading laboratories at the University of Tokyo. Students from our partner universities are eligible to participate.
Participants will be assigned to one of the laboratories of their choice and engage in research activities under the supervision of faculty members for about six weeks.
In addition to research activities, the program provides opportunities to explore Japanese culture through some events and activities.
Details
We offer two types of programs as follows:
- ESEP-G: For students from our partner universities.
- ESEP-UC: For students from the University of California (“UCEAP STEM Research in Tokyo Engineering”).
*ESEP-UC participants are not guaranteed to join our events.
Program period
June 22nd – July 31st, 2026
Opportunity is About
Eligibility
Candidates should be from:
Description of Ideal Candidate
Applicants must satisfy all below eligibility requirements:
- Applicants must be undergraduate or graduate students enrolled in a UTokyo partner university or other institution designated by the School of Engineering for the entire period of this program.(List of partner universities and designated institutions)
- Undergraduate applicants must have completed at least two full years of study in a bachelor’s degree program by the time the summer program begins.
- Applicants must remain enrolled at their current home university/institution until the ESEP program ends.
- Applicants must have a strong record of excellent academic performance.
- Applicants must have a high level of English proficiency.
- Applicants should be interested in pursuing a Ph.D.
- Applicants must not have taken part in this summer program before.
Participation requirements
- Applicants must be able to start the program on June 8, 2020 and attend the program for its entire duration.
- When UTokyo provides participants with accommodations, participants must live in their assigned accommodations.
- Participants must dedicate themselves fully to participation in the summer program.
- Participants may not take any courses or be employed during the program.
- Participants must respect the work of all laboratory members, participate in activities in the laboratory (including daily life activities), and attend laboratory meetings/gatherings.
- Participants must attend all required activities and social events.
- At the conclusion of the program, participants must submit a program report to the School of Engineering.
- Participants must secure overseas travel insurance in their home countries before coming to Japan. The insurance must cover medical expenses for injuries, illnesses, and personal liabilities.
Dates
Deadline: January 15, 2026
Program starts:
June 22, 2026
Program ends:
July 31, 2026
Cost/funding for participants
Program fee
Free of charge
ESEP Scholarship
The University of Tokyo will provide a scholarship of JPY 100,000 to each participant who meets the following requirements. The scholarship will be paid in cash.
- participating in the entire duration of the program
- staying in the accommodation provided by the program
- attending all required activities and social events
- submitting a final report to the School of Engineering at the end of the program
NOTE: Participants must bear the following costs:
- Air ticket (round-trip ticket)
- Overseas travel insurance and personal liability insurance
- Visa fee, domestic transportation fee
- Daily commuting expenses for coming to campus from the accommodation
- Everyday living expenses
FUTI Scholarships for Short-term Studies (for US universities’ students)
FUTI (Friends of UTokyo, Inc) Scholarships are for participants enrolled in US universities. If you win a FUTI scholarship, you will not be able to receive ESEP scholarship.
Internships, scholarships, student conferences and competitions.

